Volume 7, Issue 5 (September 1979)

    Stress Relaxation in Bending of Copper-Nickel-Tin Alloy Strip Strengthened by Spinodal Decomposition

    CODEN: JTEOAD

      Format Pages Price  
    PDF Version 5 $25   ADD TO CART


    Abstract

    The stress-relaxation behavior of three copper-nickel-tin alloys strengthened by spinodal decomposition was studied in the temperature range 23 to 204°C (73 to 400°F). The alloys studied were Cu-4%Ni-4%Sn, Cu-9%Ni-6%Sn, and Cu-15%Ni-8%Sn. The resistance to stress relaxation of these alloys at temperatures of 121°C (250°F) and higher is shown to be significantly improved over that of fully precipitation-hardened CA172 (Cu-1.9%Be alloy, condition TH04), a material widely used for connectors and electrical springs requiring high strength at moderately elevated temperatures. Design data that permit an evaluation of spring performance for extended service life applications are presented for these alloys.


    Author Information:

    Fox, A
    Associate member of the technical staffMember of ASTM, Bell Laboratories, Murray Hill, N.J.


    Stock #: JTE10225J

    ISSN: 0090-3973

    DOI: 10.1520/JTE10225J

    ASTM International is a member of CrossRef.

    Author
    Title Stress Relaxation in Bending of Copper-Nickel-Tin Alloy Strip Strengthened by Spinodal Decomposition
    Symposium , 0000-00-00
    Committee E28