ISSN: 1945-7553
Page Count: 3

A Technique for Examining Submicron Particulate Matter on Semiconductor Device Wafers

Berenbaum, L
Advisory engineer, IBM System Products Division—East Fishkill, Hopewell Junction,N.Y.

Abstract

A technique is described for locating and consequently removing submicron particulate matter from semiconductor device wafers. Chemical and structural analyses of these particulates are obtained from energy dispersive X-ray spectra and selected area electron diffraction patterns, respectively.

Keywords:
particulate contamination, semiconductor devices, transmission electron microscopy, energy dispersive X-ray analysis

Paper ID: JTE10180J
DOI: 10.1520/JTE10180J
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