Volume 3, Issue 5 (September 1975)

    A Technique for Examining Submicron Particulate Matter on Semiconductor Device Wafers

    CODEN: JTEOAD

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    Abstract

    A technique is described for locating and consequently removing submicron particulate matter from semiconductor device wafers. Chemical and structural analyses of these particulates are obtained from energy dispersive X-ray spectra and selected area electron diffraction patterns, respectively.


    Author Information:

    Berenbaum, L
    Advisory engineer, IBM System Products Division—East Fishkill, Hopewell Junction, N.Y.


    Stock #: JTE10180J

    ISSN: 0090-3973

    DOI: 10.1520/JTE10180J

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    Author
    Title A Technique for Examining Submicron Particulate Matter on Semiconductor Device Wafers
    Symposium , 0000-00-00
    Committee F01