Journal Published Online: 27 May 2008
Volume 36, Issue 5

Solderability Testing of Lead-Free Solder Joints Using Miniature Specimens

CODEN: JTEVAB

Abstract

A new method for mechanical testing of lead-free solder joints solderability is presented. Copper blanks are soldered with a known thermal cycle. Miniature tensile solder joints specimens are produced in large numbers from the blanks having a gage section made of lead-free solder alloy with dimensions that represent actual solder joints. Mechanical properties of Sn-3.5Ag-0.7Cu in tension at room temperature and strain-rates between 2.8×10−4–2.7×10−1s−1 have been studied. It is concluded that the solder section of the miniature joints is the weakest link in this complex structure. It was also found that the experimental results for solder strength and strain-rate sensitivity are in partial agreement with data obtained using solder bulk specimens. The role of microstructure across the joint, especially intermetallic compounds along the copper/solder interface is also discussed.

Author Information

Rosenthal, Y.
Ben-Gurion University, Beer Sheva, Israel
Sabag, O.
Nuclear Research Center Negev, Beer Sheva, Israel
Tourgeman, A.
Nuclear Research Center Negev, Beer Sheva, Israel
Zalkind, S.
Nuclear Research Center Negev, Beer Sheva, Israel
Stern, A.
Materials Engineering Dept., Ben-Gurion University, Beer Sheva, Israel
Eliezer, D.
Materials Engineering Dept., Ben-Gurion University, Beer Sheva, Israel
Pages: 8
Price: $25.00
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Stock #: JTE101388
ISSN: 0090-3973
DOI: 10.1520/JTE101388