Solderability Testing of Lead-Free Solder Joints Using Miniature Specimens

    Volume 36, Issue 5 (September 2008)

    ISSN: 0090-3973

    CODEN: JTEOAD

    Published Online: 27 May 2008

    Page Count: 8


    Rosenthal, Y.
    PhD student at the Materials Engineering Dept., Nuclear Research Center NegevBen-Gurion University, Beer ShevaBeer Sheva,

    Sabag, O.
    Nuclear Research Center Negev, Beer Sheva,

    Tourgeman, A.
    Nuclear Research Center Negev, Beer Sheva,

    Zalkind, S.
    Nuclear Research Center Negev, Beer Sheva,

    Stern, A.
    Materials Engineering Dept., Ben-Gurion University, Beer Sheva,

    Eliezer, D.
    Materials Engineering Dept., Ben-Gurion University, Beer Sheva,

    (Received 15 August 2007; accepted 15 April 2008)

    Abstract

    A new method for mechanical testing of lead-free solder joints solderability is presented. Copper blanks are soldered with a known thermal cycle. Miniature tensile solder joints specimens are produced in large numbers from the blanks having a gage section made of lead-free solder alloy with dimensions that represent actual solder joints. Mechanical properties of Sn-3.5Ag-0.7Cu in tension at room temperature and strain-rates between 2.8×10−4–2.7×10−1s−1 have been studied. It is concluded that the solder section of the miniature joints is the weakest link in this complex structure. It was also found that the experimental results for solder strength and strain-rate sensitivity are in partial agreement with data obtained using solder bulk specimens. The role of microstructure across the joint, especially intermetallic compounds along the copper/solder interface is also discussed.


    Paper ID: JTE101388

    DOI: 10.1520/JTE101388

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    Author
    Title Solderability Testing of Lead-Free Solder Joints Using Miniature Specimens
    Symposium , 0000-00-00
    Committee B02