Volume 1, Issue 4 (July 1973)

    Measurements in Silicon Planar Technology: Mechanical Properties of Semiconductor Surfaces

    CODEN: JTEOAD

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    Abstract

    Methods for growing silicon single crystals and then fabricating them into polished wafer form are reviewed. A survey of many of the parameters and measurement techniques needed to specify the polished surface is included. The activities of the Section on the Mechanical Properties of Semiconductor Surfaces are discussed.


    Author Information:

    Mendel, E
    IBM System Products Division, East Fishkill, Hopewell Junction, New York


    Stock #: JTE10023J

    ISSN: 0090-3973

    DOI: 10.1520/JTE10023J

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    Author
    Title Measurements in Silicon Planar Technology: Mechanical Properties of Semiconductor Surfaces
    Symposium , 0000-00-00
    Committee F01