ISSN: 0090-3973
Page Count: 5

Measurements in Silicon Planar Technology: Mechanical Properties of Semiconductor Surfaces
Mendel, E
IBM System Products Division, New York

Abstract

Methods for growing silicon single crystals and then fabricating them into polished wafer form are reviewed. A survey of many of the parameters and measurement techniques needed to specify the polished surface is included. The activities of the Section on the Mechanical Properties of Semiconductor Surfaces are discussed.

Keywords:
semiconductors (materials), processing, polishing, silicon, mechanical properties, measurement techniques, wafers

Paper ID: JTE10023J
DOI: 10.1520/JTE10023J
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