Adhesive Bonding and Performance Testing of Bonded Wood Products

    Volume 2, Issue 7 (July 2005)

    ISSN: 1546-962X

    CODEN: JAIOAD

    Published Online: 8 June 2005

    Page Count: 12


    Frihart, CR
    Project Leader, Wood Adhesives Science and Technology, USDA Forest Service, Forest Products Laboratory, Madison, WI

    (Received 28 September 2004; accepted 27 January 2005)

    Abstract

    Despite the importance of durable wood bonds, the factors that lead to durability are not well understood, and the internal forces exerted upon the bondline are often overlooked. Durability requires that the bonded assembly resist dimensional changes of wood with fluctuation of wood moisture levels. Both bonding and bond breaking steps need to be understood at cellular and nanoscale, in addition to the larger spatial scales normally examined. With both internal and external forces being significant, interphase and bulk adhesive properties need to be better understood. Systematic studies of the bonding process, the forces upon the bondline, and the locus of failure using different types of adhesives and wood species should improve our ability to design wood adhesives. Modifications of wood surfaces, along with spectroscopic and microscopic analyses, are important tools to understand bond formation and failure.


    Paper ID: JAI12952

    DOI: 10.1520/JAI12952

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    Author
    Title Adhesive Bonding and Performance Testing of Bonded Wood Products
    Symposium Advances in Adhesives, Adhesion Science, and Testing, 2004-10-06
    Committee D14