Volume 7, Issue 5 (May 2010)

    Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint

    (Received 2 February 2010; accepted 21 April 2010)

    Published Online: 2010

    CODEN: JAIOAD

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    Abstract

    In this paper, single solder joints (SSJs) were subjected to moderate speed loading (5 mm/s) in different directions, from pure tensile mixity mode to pure shear. Fracture surfaces from different loading directions were examined both experimentally and numerically. The intermetallic compound (IMC) is formed between the solder alloy and the Cu pad, and the failure typically occurs at or near the solder/IMC/Cu interfaces of the board side. Pure tensile loading typically leads to interfacial fracture along the IMC/Cu interface. Mixity mode loading usually results in a mixture of interfacial and cohesive failure with damage propagating in a zigzag fashion between the solder/IMC interface and the solder alloy. Loading with higher shear component tends to result in more cohesive failure of the solder alloy near the solder/IMC interface. Under pure shear loading, failure is almost always cohesive within the solder alloy near the solder/IMC interface.


    Author Information:

    Gao, Feng
    George W. Woodruff School of Mechanical Engineering, Georgia Institute of TechnologyMcCormick School of Engineering and Applied Science, Northwestern Univ., AtlantaEvanston, GAIL

    Jing, Jianping
    The State Key Laboratory of Mechanical System and Vibration, Shanghai JiaoTong Univ., Shanghai,

    Liang, Frank Z.
    Intel Corporation, Hillsboro, OR

    Williams, Richard L.
    Intel Corporation, Hillsboro, OR

    Qu, Jianmin
    George W. Woodruff School of Mechanical Engineering, Georgia Institute of TechnologyMcCormick School of Engineering and Applied Science, Northwestern Univ., AtlantaEvanston, GAIL


    Stock #: JAI103021

    ISSN: 1546-962X

    DOI: 10.1520/JAI103021

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    Author
    Title Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
    Symposium , 0000-00-00
    Committee F01