(Received 15 August 1999; accepted 24 July 2000)
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In this paper, an analytical solution is presented for a shaft-loaded blister test for a thin film-substrate system. Both bending and stretching modes of deformation of the film are considered in the model. It is suggested that film-substrate delamination behavior under a Mode I separation load is governed by a parameter that relates the membrane stress to the rigidity of the film. The delamination behavior of several model thin film-substrate systems under repeated mechanical loads is studied. It is suggested from the results that film-substrate delamination under cyclic load depends on film rigidity, loading frequency, and film-substrate interfacial characteristics.
School of Mechanical and Production Engineering, Nanyang Technological University,
School of Materials Engineering, Nanyang Technological University,
Stock #: CTR10908J