Evaluation of Film-Substrate Interface Durability Using a Shaft-Loaded Blister Test

    Volume 23, Issue 1 (January 2001)

    ISSN: 0884-6804

    CODEN: CTROAD

    Page Count: 6


    Wan, KT
    School of Mechanical and Production Engineering, Nanyang Technological University,

    Liao, K
    School of Materials Engineering, Nanyang Technological University,

    (Received 15 August 1999; accepted 24 July 2000)

    Abstract

    In this paper, an analytical solution is presented for a shaft-loaded blister test for a thin film-substrate system. Both bending and stretching modes of deformation of the film are considered in the model. It is suggested that film-substrate delamination behavior under a Mode I separation load is governed by a parameter that relates the membrane stress to the rigidity of the film. The delamination behavior of several model thin film-substrate systems under repeated mechanical loads is studied. It is suggested from the results that film-substrate delamination under cyclic load depends on film rigidity, loading frequency, and film-substrate interfacial characteristics.


    Paper ID: CTR10908J

    DOI: 10.1520/CTR10908J

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    Author
    Title Evaluation of Film-Substrate Interface Durability Using a Shaft-Loaded Blister Test
    Symposium , 0000-00-00
    Committee D30