Volume 2, Issue 3 (July 1980)

    Structural Adhesives Rheological Behavior Response to Process-Environmental Variation

    CODEN: CTROAD

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    Abstract

    Adhesive bonding operations have been randomly plagued with mechanical and physical (flow, bond line thickness, slick-off, etc.) problems. In an effort to define some of the sources for such problems, we investigated the relationship between environmental (humidity, aging) and cure cycle variations on the adhesive processing characteristics (flow, rheological behavior) as well as mechanical properties. Six adhesives, including some from competitive manufacturing origins, were used for general comparison to ensure that the observed trends were not generic to specific formulations. In this paper, we present a summary of the results.


    Author Information:

    Thuen, JM
    Narmco Materials Inc., Costa Mesa, CA

    Hinrichs, RJ
    Narmco Materials Inc., Costa Mesa, CA


    Stock #: CTR10707J

    ISSN: 0884-6804

    DOI: 10.1520/CTR10707J

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    Author
    Title Structural Adhesives Rheological Behavior Response to Process-Environmental Variation
    Symposium , 0000-00-00
    Committee D30