ISSN: 0884-6804
Page Count: 9

Residual Thermal and Moisture Influences on the Analysis of Local Delaminations
O'Brien, TK
Senior scientist, U.S. Army Aerostructures Directorate, NASA Langley Research Center, VA

Abstract

An analysis using laminated plate theory is developed to calculate the strain energy release rate associated with local delaminations originating at off-axis, angle-ply, matrix cracks in laminates subjected to uniaxial loads. The analysis includes the contribution of residual thermal and moisture stresses to the strain energy released. Examples are calculated for the strain energy release rate associated with local delaminations originating at 90° and angle-ply (non 90°) matrix-ply cracks in glass-epoxy and graphite-epoxy laminates. The solution developed may be used to assess the relative contribution of mechanical, residual thermal, and moisture stresses on the strain energy release rate for local delamination for a variety of layups and materials.

Keywords:
residual thermal stress, hygroscopic stress, moisture, strain energy release rate, delamination, matrix crack

Paper ID: CTR10087J
DOI: 10.1520/CTR10087J
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