1. Scope 1.1 This practice establishes methods for thermal vacuum bakeout of spacecraft hardware that are an integral part of a spacecraft system with contamination-sensitive hardware. 1.2 This practice defines the equipment, environment, and certification criteria for each type of component with respect to its location relative to the contamination-sensitive hardware. 1.3 The methods defined in this practice are intended to reduce component outgassing rates such that they are consistent with levels necessary to meet mission performance requirements of the contamination-sensitive hardware. 1.4 This practice defines three bakeout methods: Method A, which is a standard procedure using prescribed time and pressure criteria (no TQCM); Method B, using prescribed stabilization rate criteria; and Method C, which allows the use of program specific bakeout criteria. 1.5 The suitability of any of these methods must be determined by the contractors program for which it is used. 1.6 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. 1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
11.1 contamination; contamination sensitivity; outgassing; outgassing rate; spacecraft testing; TQCM; thermal vacuum bakeout; vacuum bakeout; vacuum testing:
The title and scope are in draft form and are under development within this ASTM Committee.
Citing ASTM Standards
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