ASTM WK42323

    Work Item: ASTM WK42323 - Withdrawal of F542 - 07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

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    Developed by Subcommittee: D09.01 | Committee D09 | Contact Staff Manager



    This standard is being balloted for withdrawal with no replacement because this standard is no longer in use.


    Keywords

    electronic; encapsulating compounds; exothermic temperature; microelectronic encapsulation;
    Citing ASTM Standards
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    Work Item Status

    Date Initiated:
    05-30-2013

    Technical Contact:
    Mark Winkeler

    Item:
    008

    Ballot:
    D09 (13-04)

    Status:
    Ballot Item Approved as F542-2007 and Pending Publication