ASTM WK40888

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Work Item: ASTM WK40888 - Revision of F677 - 04(2009) Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

Active Standard: F677 - 13

Developed by Subcommittee: D09.01 | Committee D09 Home | Contact Staff Manager

1. Rationale

This item needs to be re-approved as an American National Standard. The only changes being made are the elimination of non-mandatory language.

Keywords

electronic; encapsulating compound; grease; microelectronics; Electronic encapsulants; Electronic materials/applications; Fluid resistance; Grease resistance; Microelectronic devices

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Work Item Status:
Date Initiated:02-12-2013
Technical Contact: Marcelo Hirschler

Status: Draft Under Development

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