ASTM WK39499

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Work Item: ASTM WK39499 - Revision of F459 - 06 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

Active Standard: F459 - 13

Developed by Subcommittee: F01.07 | Committee F01 Home | Contact Staff Manager

1. Rationale

Changes in applicable metallurgy, removed Al ball bonds and added Copper wire (the newest high volume wire bonding material). Plus a reference describing it. Modern measurement tools have been allowed and test conditions have been clarified.

Keywords

pull strength of microelectronic wire bonds; aluminum ultra-sonic wedge bonds; aluminum ball bonds; gold wedge bonds; ball bonds; wire bonds;

Citing ASTM Standards

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Work Item Status:
Date Initiated:10-26-2012
Technical Contact: George Harman

Item: 002
Ballot: F01 (12-02)
Status: Ballot Item Approved as F459-2013 and Pending Publication

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