This test method describes the analysis of Ag, Al, As, Au, Bi, Cd, Co, Cu, Fe, Ge, In, Ni, P, Pb, Sb, and Zn in tin based solder alloys using optical emission spectrometry (OES).
elemental analysis; solder; OES; optical emission spectrometry; spectrometry
The title and scope are in draft form and are under development within this ASTM Committee.
Citing ASTM Standards
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