Standards Related to F1512 - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies /
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Developed By: Committee B02 on Nonferrous Metals and Alloys
Developed By: Committee F01 on Electronics
Developed By: Committee D09 on Electrical and Electronic Insulating Materials
Developed By: Committee F02 on Flexible Barrier Packaging
