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D4138-07a
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Standard Practices for Measurement of Dry Film Thickness of Protective Coating Systems by Destructive, Cross-Sectioning Means
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Also Available in these Collections:
Developed By: Committee D01 on Paint and Related Coatings, Materials, and Applications
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A755/A755M-11
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Standard Specification for Steel Sheet, Metallic Coated by the Hot-Dip Process and Prepainted by the Coil-Coating Process for Exterior Exposed Building Products
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Also Available in these Collections:
Developed By: Committee A05 on Metallic-Coated Iron and Steel Products
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D4414-95(2007)
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Standard Practice for Measurement of Wet Film Thickness by Notch Gages
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Also Available in these Collections:
Developed By: Committee D01 on Paint and Related Coatings, Materials, and Applications
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D6132-08
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Standard Test Method for Nondestructive Measurement of Dry Film Thickness of Applied Organic Coatings Using an Ultrasonic Gage
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Also Available in these Collections:
Developed By: Committee D01 on Paint and Related Coatings, Materials, and Applications
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D7091-12
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Standard Practice for Nondestructive Measurement of Dry Film Thickness of Nonmagnetic Coatings Applied to Ferrous Metals and Nonmagnetic, Nonconductive Coatings Applied to Non-Ferrous Metals
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Also Available in these Collections:
Developed By: Committee D01 on Paint and Related Coatings, Materials, and Applications
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D7803-12
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Standard Practice for Preparation of Zinc (Hot-Dip Galvanized) Coated Iron and Steel Product and Hardware Surfaces for Powder Coating
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Also Available in these Collections:
Developed By: Committee D01 on Paint and Related Coatings, Materials, and Applications
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A1003/A1003M-13a
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Standard Specification for Steel Sheet, Carbon, Metallic- and Nonmetallic-Coated for Cold-Formed Framing Members
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Also Available in these Collections:
Developed By: Committee A05 on Metallic-Coated Iron and Steel Products
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F1844-97(2008)
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Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
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Also Available in these Collections:
Developed By: Committee F01 on Electronics
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