ASTM E1237

Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent surface preparation, mounting procedures, and verification techniques.

1. Scope

1.1 This document provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.

1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

2. Referenced Documents

E251 Test Methods for Performance Characteristics of Metallic Bonded Resistance Strain Gages
ANSI/SEM 1-1984; Standard for Portable Strain-Indicating Instruments-Designation of Strain Gage Bridge and Color Code of Terminal Connections; August 16, 1984.

Index Terms

Adhesion; Adhesive bonding; Base-metal substrates; Bonded resistance strain gages; Bonding; Bond strength; Electrical measurements; Environmental control/fate; Etched foil resistance strain gages; Expansion; Heating tests-metals; Installation; Resistance; Resistance gages; Solder/soldering applications; Strain gages; Strain testing-metallic materials; Stress-metallic materials; Thermal coefficient of expansion; Verification; installing bonded resistance strain gages, guide; ICS Number Code 19.060

Citing ASTM Standards

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