ASTM B885-97(2003)

    Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

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    1. Scope

    1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.

    1.2 Practice B 667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B 667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers.

    1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar will all hazards including those identified in the appropriate Material Safety Data Sheet for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.


    2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.

    ASTM Standards

    B539 Test Methods for Measuring Resistance of Electrical Connections (Static Contacts)

    B542 Terminology Relating to Electrical Contacts and Their Use

    B667 Practice for Construction and Use of a Probe for Measuring Electrical Contact Resistance


    ICS Code

    ICS Number Code 31.180 (Printed circuits and boards)

    UNSPSC Code

    UNSPSC Code 26121700(Wiring harness)


    DOI: 10.1520/B0885-97R03

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