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1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.
1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.
1.3 This specification is not intended for electrodeposited copper when used for electroforming.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
B320 Practice for Preparation of Iron Castings for Electroplating
B374 Terminology Relating to Electroplating
B487 Test Method for Measurement of Metal and Oxide Coating Thickness by Microscopical Examination of Cross Section
B499 Test Method for Measurement of Coating Thicknesses by the Magnetic Method: Nonmagnetic Coatings on Magnetic Basis Metals
B504 Test Method for Measurement of Thickness of Metallic Coatings by the Coulometric Method
B507 Practice for Design of Articles to Be Electroplated on Racks
B568 Test Method for Measurement of Coating Thickness by X-Ray Spectrometry
B571 Practice for Qualitative Adhesion Testing of Metallic Coatings
B588 Test Method for Measurement of Thickness of Transparent or Opaque Coatings by Double-Beam Interference Microscope Technique
B602 Test Method for Attribute Sampling of Metallic and Inorganic Coatings
B678 Test Method for Solderability of Metallic-Coated Products
B697 Guide for Selection of Sampling Plans for Inspection of Electrodeposited Metallic and Inorganic Coatings
B762 Test Method of Variables Sampling of Metallic and Inorganic Coatings
B765 Guide for Selection of Porosity and Gross Defect Tests for Electrodeposits and Related Metallic Coatings
ICS Number Code 25.220.40 (Metallic coatings)
UNSPSC Code 12141711(Copper Cu)
ASTM B734-97(2003)e1, Standard Specification for Electrodeposited Copper for Engineering Uses, ASTM International, West Conshohocken, PA, 2003, www.astm.orgBack to Top