SUPERSEDED (click for Active standard)
| ||Format||Pages||Price|| |
|9||$51.60||  ADD TO CART|
1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-coppersilver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC - Association Connecting Electronic Industries.
1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800oF (430oC).
1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
2. Referenced Documents (purchase separately) The documents listed below are referenced within the subject standard but are not provided as part of the standard.
D269 Test Method for Insoluble Matter in Rosin and Rosin Derivatives
D464 Test Methods for Saponification Number of Naval Store Products Including Tall Oil and Other Related Products
D465 Test Methods for Acid Number of Naval Stores Products Including Tall Oil and Other Related Products
D509 Test Methods of Sampling and Grading Rosin
E28 Test Methods for Softening Point of Resins Derived from Pine Chemicals and Hydrocarbons, by Ring-and-Ball Apparatus
E29 Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
E46 Test Methods for Chemical Analysis of Lead- and Tin-Base Solder
E51 Method for Spectrographic Analysis of Tin Alloys by the Powder Technique
E55 Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
E87 Methods for Chemical Analysis of Lead, Tin, Antimony and Their Alloys (Photometric Method)
E88 Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition
Federal StandardFed.Std.No.123 Marking for Shipment (Civil Agencies)
Military StandardMIL-STD-129 Marking for Shipment and Storage
ASTM B32-00, Standard Specification for Solder Metal, ASTM International, West Conshohocken, PA, 2000, www.astm.orgBack to Top