Technical Committees / Committee F01 / Committee Publications

Publications Sponsored by Committee F01 on Electronics:

Annual Book of ASTM Standards

• Volume 10.04 Electronics; Declarable Substances in Materials; 3D Imaging Systems

Special Technical Publications (STPs)

• STP 1382 Gate Dielectric Integrity: Material, Process, and Tool Qualification
• STP 1340 Recombination Lifetime Measurement in Silicon
• STP 1141 Laser-Induced Damage in Optical Materials
• STP 1117 Laser Induced Damage in Optical Materials
• STP 1113 Food Packaging Technology
• To see complete list, click here.

Adjuncts

• Adjunct to F584 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Related Journal Papers:

Journal of ASTM International

• Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
• Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures
• Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
• The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
• Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
• To see complete list, click here.

Journal of Testing and Evaluation

• Evaluation of A Humidity Sensor for Use in An Environment Exposed to Radiation
• Surface Roughness Measurement Using Laser Speckle Statistical Analysis
• Application of 3-D Laser Scanning Technique to Slope Movement Monitoring
• Failure Analysis Using Microfocus X-ray Imaging
• Testing and Design of CMOS D-Latches
• To see complete list, click here.