Technical Committees / Committee F01 / Committee Publications

Journal of ASTM International

• Empirical Modeling of the Time-Dependent Structural Build-up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications
• Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures
• Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling
• The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders
• Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
• Wetting Behavior of Solders