Subcommittees and Standards

Showing results 1-16 of 16 matching ACTIVE standards under the jurisdiction of F01.17     F01 Home

F390-11 Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array

F1238-95(2011) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

F1367-98(2011) Standard Specification for Chromium Sputtering Targets for Thin Film Applications

F1512-94(2011) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies

F1513-99(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

F1593-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer

F1594-95(2011) Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications

F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

F1710-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer

F1711-96(2008) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method

F1761-00(2011) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets

F1844-97(2008) Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage

F1845-08 Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer

F1894-98(2011) Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness

F2113-01(2011) Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications

F2405-04(2011) Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer

0 matching Proposed New Standards under the jurisdiction of F01.17     F01 Home

F2086-01 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2 (Withdrawn 2007)

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