Subcommittees and Standards

Showing results 1-6 of 6 matching ACTIVE standards under the jurisdiction of F01.07     F01 Home

F72-06 Standard Specification for Gold Wire for Semiconductor Lead Bonding

F458-13 Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2
    See also WK39500 proposed revision

F459-13 Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
    See also WK39499 proposed revision

F487-13 Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
    See also WK39501 proposed revision

F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

F637-85(2001) Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices (Withdrawn 2006)

F638-88(2001) Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

F1211-89(2001) Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)

F1269-13 Standard Test Methods for Destructive Shear Testing of Ball Bonds
    See also WK39502 proposed revision

0 matching Proposed New Standards under the jurisdiction of F01.07     F01 Home

F637-85(2001) Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices (Withdrawn 2006)

F638-88(2001) Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

F1211-89(2001) Standard Specification for Semiconductor Device Passivation Opening Layouts (Withdrawn 2007)

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