Subcommittees and Standards

Showing results 1-27 of 27 matching ACTIVE standards under the jurisdiction of F01.03     F01 Home

F7-95(2011) Standard Specification for Aluminum Oxide Powder

F15-04(2009) Standard Specification for Iron-Nickel-Cobalt Sealing Alloy

F16-67(2006) Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
    See also WK32486 proposed revision

F18-64(2006) Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
    See also WK32485 proposed revision

F19-11 Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals

F29-97(2009) Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications

F30-96(2009) Standard Specification for Iron-Nickel Sealing Alloys

F31-05(2010) Standard Specification for 42% Nickel-6% Chromium-Iron Sealing Alloy
    See also WK31765 proposed revision

F44-95(2011) Standard Specification for Metallized Surfaces on Ceramic

F73-96(2009) Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps

F83-71(2009) Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters

F85-76(2009) Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes

F96-77(2010) Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms

F106-06 Standard Specification for Brazing Filler Metals for Electron Devices
    See also WK32487 proposed revision

F180-94(2010)e1 Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices

F204-76(2009) Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire

F205-94(2010)e1 Standard Test Method for Measuring Diameter of Fine Wire by Weighing

F219-96(2009) Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps

F256-05(2010) Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium

F269-60(2009) Standard Test Method for Sag of Tungsten Wire

F288-96(2009) Standard Specification for Tungsten Wire for Electron Devices and Lamps

F289-96(2009) Standard Specification for Molybdenum Wire and Rod for Electronic Applications

F290-94(2010) Standard Specification for Round Wire for Winding Electron Tube Grid Laterals

F364-96(2009) Standard Specification for Molybdenum Flattened Wire for Electron Tubes

F375-89(2010) Standard Specification for Integrated Circuit Lead Frame Material

F1466-99(2010) Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications

F1684-06(2011) Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications

0 matching Proposed New Standards under the jurisdiction of F01.03     F01 Home

F1-03 Standard Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes (Withdrawn 2009)

F3-02a Standard Specification for Nickel Strip for Electron Tubes (Withdrawn 2008)

F4-66(2005) Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes (Withdrawn 2010)

F23-90(1995)E01 Guide for Selecting Methods of Temperature Measurement of Thermionic Emitters (Withdrawn 2001)

F78-97(2002) Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)

F97-72(2002)e1 Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration (Withdrawn 2008)

F111-96(2002) Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters (Withdrawn 2008)

F357-78(2002) Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)

F508-77(2002) Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)

F692-97(2002) Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)

F798-97(2002) Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region (Withdrawn 2008)

F816-83(2003) Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009)

F979-86(2003) Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)

Back to the Main Committee Page