Subcommittees and Standards

Standards under the jurisdiction of F01

Each main committee in ASTM International is composed of subcommittees that address specific segments within the general subject area covered by the technical committee. Click on the subcommittee links below to see the title of existing standards for each subcommittee. Then, click on the resulting titles to see the standard's scope, referenced documents, and more.

F01.03 Metallic Materials
F01.07 Wire Bonding, Flip Chip, and Tape Automated Bonding
F01.10 Contamination Control
F01.11 Nuclear and Space Radiation Effects
F01.15 Compound Semiconductors
F01.17 Sputter Metallization
F01.18 Membrane Switches
F01.90 Executive
F01.95 Reference Materials


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