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Technical Committees / Committee F01 / List of Subcommittees and Standards Committee F01 on Electronics Subcommittees and Standards
Standards under the jurisdiction of F01 Each main committee in ASTM International is composed of subcommittees that address specific segments within the general subject area covered by the technical committee. Click on the subcommittee links below to see the title of existing standards for each subcommittee. Then, click on the resulting titles to see the standard's scope, referenced documents, and more. F01.03 Metallic MaterialsF01.07 Wire Bonding, Flip Chip, and Tape Automated Bonding F01.10 Contamination Control F01.11 Nuclear and Space Radiation Effects F01.15 Compound Semiconductors F01.17 Sputter Metallization F01.18 Membrane Switches F01.90 Executive F01.95 Reference Materials | ||
