Committee F01 on Electronics

    Staff Manager: W Scott Orthey 610-8329730


    Subcommittees and Standards

    Standards under the jurisdiction of F01

    Each main committee in ASTM International is composed of subcommittees that address specific segments within the general subject area covered by the technical committee. Click on the subcommittee links below to see the title of existing standards for each subcommittee. Then, click on the resulting titles to see the standard's scope, referenced documents, and more.

    F01.03 Metallic Materials
    F01.07 Wire Bonding, Flip Chip, and Tape Automated Bonding
    F01.10 Contamination Control
    F01.11 Nuclear and Space Radiation Effects
    F01.15 Compound Semiconductors
    F01.17 Sputter Metallization
    F01.18 Membrane Switches
    F01.90 Executive
    F01.95 Reference Materials