Information from fatigue practitioners active in the microelectronics area that assess the current state and direction of fatigue/reliability research. 9 peer-reviewed papers provide:

• Valuable insight into the various methods in use to characterize the fatigue/creep interactions within solder under typical temperature and loading ranges of electronic systems

• Details on the complexity of fatigue/reliability testing of electronic component systems

• An excellent overview of the inherent complexities in accelerated fatigue testing of materials subject to high homologous temperatures and continual microstructural changes

• Examples of fatigue and creep characterization applied to reliability assessments of actual electronic components.