Information from fatigue practitioners active in the microelectronics area that assess the current state and direction of fatigue/reliability research. 9 peer-reviewed papers provide:
Valuable insight into the various methods in use to characterize the fatigue/creep interactions within solder under typical temperature and loading ranges of electronic systems
Details on the complexity of fatigue/reliability testing of electronic component systems
An excellent overview of the inherent complexities in accelerated fatigue testing of materials subject to high homologous temperatures and continual microstructural changes
Examples of fatigue and creep characterization applied to reliability assessments of actual electronic components.