ASTM Volume 10.04, April 2011

    Electronics; Declarable Substances in Materials; 3D Imaging Systems

    Table of Contents

    E2544-10 Terminology for Three-Dimensional (3D) Imaging Systems
    E2641-09 Practice for Best Practices for Safe Application of 3D Imaging Technology
    F0007-95R06 Specification for Aluminum Oxide Powder
    F0015-04R09 Specification for Iron-Nickel-Cobalt Sealing Alloy
    F0016-67R06 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
    F0018-64R06 Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
    F0019-64R05E01 Test Method for Tension and Vacuum Testing Metallized Ceramic Seals
    F0029-97R09 Specification for Dumet Wire for Glass-to-Metal Seal Applications
    F0030-96R09 Specification for Iron-Nickel Sealing Alloys
    F0031-05R10 Specification for 42 \% Nickel-6 \% Chromium-Iron Sealing Alloy
    F0044-95R06 Specification for Metallized Surfaces on Ceramic
    F0072-06 Specification for Gold Wire for Semiconductor Lead Bonding
    F0073-96R09 Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
    F0076-08 Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors
    F0083-71R09 Practice for Definition and Determination of Thermionic Constants of Electron Emitters
    F0085-76R09 Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes
    F0096-77R10 Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
    F0106-06 Specification for Brazing Filler Metals for Electron Devices
    F0180-94R10E01 Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices
    F0204-76R09 Test Method for Surface Flaws in Tungsten Seal Rod and Wire
    F0205-94R10E01 Test Method for Measuring Diameter of Fine Wire by Weighing
    F0219-96R09 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
    F0256-05R10 Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
    F0269-60R09 Test Method for Sag of Tungsten Wire
    F0288-96R09 Specification for Tungsten Wire for Electron Devices and Lamps
    F0289-96R09 Specification for Molybdenum Wire and Rod for Electronic Applications
    F0290-94R10 Specification for Round Wire for Winding Electron Tube Grid Laterals
    F0364-96R09 Specification for Molybdenum Flattened Wire for Electron Tubes
    F0375-89R10 Specification for Integrated Circuit Lead Frame Material
    F0390-98R03 Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array
    F0448-99R05 Test Method for Measuring Steady-State Primary Photocurrent
    F0458-06 Practice for Nondestructive Pull Testing of Wire Bonds
    F0459-06 Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
    F0487-88R06 Specification for Fine Aluminum\N1 \% Silicon Wire for Semiconductor Lead-Bonding
    F0526-97R03 Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests
    F0528-99R05 Test Method of Measurement of Common-Emitter DC Current Gain of Junction Transistors
    F0584-06E01 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
    F0615M-95R08 Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric)
    F0744M-10 Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)
    F0773M-10 Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric)
    F0980-10 Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
    F0996-11 Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current\NVoltage Characteristics
    F1094-87R05 Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
    F1190-99R05 Guide for Neutron Irradiation of Unbiased Electronic Components
    F1192-00R06 Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
    F1238-95R03 Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
    F1262M-95R08 Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric)
    F1263-99R05 Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
    F1269-06 Test Methods for Destructive Shear Testing of Ball Bonds
    F1367-98R03 Specification for Chromium Sputtering Targets for Thin Film Applications
    F1372-93R05 Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components
    F1373-93R05 Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components
    F1374-92R05 Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components
    F1375-92R05 Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components
    F1376-92R05 Guide for Metallurgical Analysis for Gas Distribution System Components
    F1394-92R05 Test Method for Determination of Particle Contribution from Gas Distribution System Valves
    F1396-93R05 Test Method for Determination of Oxygen Contribution by Gas Distribution System Components
    F1397-93R05 Test Method for Determination of Moisture Contribution by Gas Distribution System Components
    F1398-93R05 Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components
    F1404-92R07 Test Method for Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique
    F1438-93R05 Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components
    F1466-99R10 Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications
    F1467-99R05E01 Guide for Use of an X-Ray Tester (|mF10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
    F1512-94R03 Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
    F1513-99R03 Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
    F1578-07 Test Method for Contact Closure Cycling of a Membrane Switch
    F1593-08 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer
    F1594-95R03 Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications
    F1595-00R05 Practice for Viewing Conditions for Visual Inspection of Membrane Switches
    F1596-07 Test Method for Exposure of Membrane Switches to Temperature and Relative Humidity
    F1598-95R07 Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)
    F1661-09 Test Method for Determining the Contact Bounce Time of a Membrane Switch
    F1662-10 Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch
    F1663-09 Test Method for Determining the Capacitance of a Membrane Switch
    F1680-07A Test Method for Determining Circuit Resistance of a Membrane Switch
    F1681-07A Test Method for Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit
    F1683-09 Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component
    F1684-06 Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications
    F1689-05 Test Method for Determining the Insulation Resistance of a Membrane Switch
    F1709-97R08 Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
    F1710-08 Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
    F1711-96R08 Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
    F1761-00R05 Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets
    F1762-07 Practice for Exposing a Membrane Switch to Variation in Atmospheric Pressure
    F1812-09 Test Method for Determining the Effectiveness of Membrane Switch ESD Shielding
    F1842-09 Test Method for Determining Ink or Coating Adhesion on Plastic Substrates for Membrane Switch Applications
    F1843-09 Practice for Sample Preparation of Transparent Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements
    F1844-97R08 Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
    F1845-08 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer
    F1892-06 Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
    F1893-98R03 Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
    F1894-98R03 Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness
    F1895-10A Test Method for Submersion of a Membrane Switch
    F1896-10 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    F1995-00R05 Test Method for Determining the Bond Strength of a Surface Mount Device (SMD) on a Membrane Switch by Applying Shear Force
    F1996-06 Test Method for Silver Migration for Membrane Switch Circuitry
    F2072-01R07 Practice for Hosedown of a Membrane Switch
    F2073-01R06 Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch
    F2112-02 Terminology for Membrane Switches
    F2113-01R07 Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
    F2187-02 Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
    F2188-02 Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
    F2357-10 Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool |P`RCA|P' Abrader,
    F2358-04 Guide for Measuring Characteristics of Sapphire Substrates
    F2359-04 Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source
    F2360-08 Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source
    F2405-04 Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
    F2576-09 Terminology Relating to Declarable Substances in Materials
    F2577-06 Guide for Assessment of Materials and Products for Declarable Substances
    F2592-10 Test Method for Measuring the Force-Displacement of a Membrane Switch
    F2617-08E01 Test Method for Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry
    F2725-08 Guide for European Union's Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange
    F2749-09 Test Method for Determining the Effects of Creasing a Membrane Switch or Assembly
    F2750-09 Test Method for Determining the Effects of Bending a Membrane Switch or Assembly
    F2771-10 Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient Conditions
    F2792-10E01 Terminology for Additive Manufacturing Technologies,
    F2853-10 Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams
    F2866-10 Test Method for Flammability of a Membrane Switch in Defined Assembly

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    - 2011
       Standards: 124
       Pages: 752

    - 2010
       Standards: 126
       Pages: 740