Table of Contents

E1392 Practice for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces
F0001-03 Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes
F0003-02A Specification for Nickel Strip for Electron Tubes
F0004-66R05 Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes
F0007-95R06 Specification for Aluminum Oxide Powder
F0015-04 Specification for Iron-Nickel-Cobalt Sealing Alloy
F0016-67R00 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
F0018-64R06 Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
F0019-64R05E01 Test Method for Tension and Vacuum Testing Metallized Ceramic Seals
F0026 Test Methods for Determining the Orientation of a Semiconductive Single Crystal
F0028 Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
F0029-97R02 Specification for Dumet Wire for Glass-to-Metal Seal Applications
F0030-96R02 Specification for Iron-Nickel Sealing Alloys
F0031-05 Specification for 42 \% Nickel-6 \% Chromium-Iron Sealing Alloy
F0042 Test Methods for Conductivity Type of Extrinsic Semiconducting Materials
F0043 Test Methods for Resistivity of Semiconductor Materials
F0044-95R06 Specification for Metallized Surfaces on Ceramic
F0072-95R01 Specification for Gold Wire for Semiconductor Lead Bonding
F0073-96R02 Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
F0076-86R02 Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors
F0078-97R02 Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards
F0081 Test Method for Measuring Radial Resistivity Variation on Silicon Wafers
F0083-71R02 Practice for Definition and Determination of Thermionic Constants of Electron Emitters
F0084 Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe
F0085-76R02 Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes
F0095 Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer
F0096-77R05 Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
F0097-72R02E01 Practices for Determining Hermeticity of Electron Devices by Dye Penetration
F0106-06 Specification for Brazing Filler Metals for Electron Devices
F0110 Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique
F0111-96R02 Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters
F0154 Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces
F0180-94R05 Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices
F0204-76R02 Test Method for Surface Flaws in Tungsten Seal Rod and Wire
F0205-94R05 Test Method for Measuring Diameter of Fine Wire by Weighing
F0219-96R02 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
F0256-05E01 Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
F0269-60R02 Test Method for Sag of Tungsten Wire
F0288-96R02 Specification for Tungsten Wire for Electron Devices and Lamps
F0289-96R02 Specification for Molybdenum Wire and Rod for Electronic Applications
F0290-94R05 Specification for Round Wire for Winding Electron Tube Grid Laterals
F0357-78R02 Practice for Determining Solderability of Thick Film Conductors\t
F0358-83R02 Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers\t
F0364-96R02 Specification for Molybdenum Flattened Wire for Electron Tubes
F0374 Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure
F0375-89R05 Specification for Integrated Circuit Lead Frame Material
F0390-98R03 Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array
F0391 Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage
F0397 Test Method for Resistivity of Silicon Bars Using a Two-Point Probe
F0398 Test Method for Majority Carrier Concentration in Semiconductors by Measurement of Wavenumber or Wavelength of the Plasma Resonance Minimum
F0418-77R02 Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements
F0448-99R05 Test Method for Measuring Steady-State Primary Photocurrent
F0458-06 Practice for Nondestructive Pull Testing of Wire Bonds
F0459-84R01 Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
F0487-88R06 Specification for Fine Aluminum\N1 \% Silicon Wire for Semiconductor Lead-Bonding
F0508-77R02 Practice for Specifying Thick-Film Pastes\t
F0523 Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
F0525 Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe
F0526-97R03 Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests
F0528-99R05 Test Method of Measurement of Common-Emitter DC Current Gain of Junction Transistors
F0533 Test Method for Thickness and Thickness Variation of Silicon Wafers
F0534 Test Method for Bow of Silicon Wafers
F0576 Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
F0584-87R05 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
F0615M-95R02 Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components \[Metric\]
F0616M-96R03 Test Method for Measuring MOSFET Drain Leakage Current \[Metric\]
F0617-00 Test Method for Measuring MOSFET Linear Threshold Voltage
F0637 Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices
F0638 Specification for Fine Aluminum\M1 \% Magnesium Wire for Semiconductor Lead-Bonding
F0657 Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning
F0671 Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
F0672 Test Method for Measuring Resistivity Profiles Perpendicular to the Surface of a Silicon Wafer Using a Spreading Resistance Probe
F0673 Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage
F0674 Practice for Preparing Silicon for Spreading Resistance Measurements
F0676-97R03 Test Method for Measuring Unsaturated TTL Sink Current
F0692-97R02 Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
F0723 Practice for Conversion Between Resistivity and Dopant Density for Boron-Doped, Phosphorus-Doped, and Arsenic-Doped Silicon
F0728 Practice for Preparing An Optical Microscope for Dimensional Measurements
F0744M-97R03 Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits \[Metric\]
F0769-00 Test Method for Measuring Transistor and Diode Leakage Currents
F0773M-96R03 Practice for Measuring Dose Rate Response of Linear Integrated Circuits \[Metric\]
F0798-97R02 Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region\t
F0816-83R03 Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages
F0847 Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques
F0928 Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
F0950 Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Slice Surface by Angle Polishing and Defect Etching
F0951 Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers
F0978 Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques
F0979-86R03 Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding
F0980M-96R03 Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices \[Metric\]
F0996-98R03 Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current\NVoltage Characteristics
F1048 Test Method for Measuring the Effective Surface Roughness of Optical Components by Total Integrated Scattering
F1049 Practice for Shallow Etch Pit Detection on Silicon Wafers
F1094-87R05 Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
F1152 Test Method for Dimensions of Notches on Silicon Wafers
F1153 Test Method for Characterization of Metal-Oxide-Silicon (MOS) Structures by Capacitance-Voltage Measurements
F1188 Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption with Short Baseline
F1190-99R05 Guide for Neutron Irradiation of Unbiased Electronic Components
F1192-00 Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
F1211-89R01 Specification for Semiconductor Device Passivation Opening Layouts
F1212-89R02 Test Method for Thermal Stability Testing of Gallium Arsenide Wafers
F1238-95R03 Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
F1239 Test Method for Oxygen Precipitation Characteristics of Silicon Wafers by Measurement of Interstitial Oxygen Reduction
F1241 Terminology of Silicon Technology
F1259M-96R03 Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration \[Metric\]
F1260M-96R03 Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations \[Metric\]
F1261M-96R03 Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line \[Metric\]
F1262M-95R02 Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits [Metric]
F1263-99R05 Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
F1269-89R01 Test Methods for Destructive Shear Testing of Ball Bonds
F1366 Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry
F1367-98R03 Specification for Chromium Sputtering Targets for Thin Film Applications
F1372-93R05 Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components
F1373-93R05 Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components
F1374-92R05 Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components
F1375-92R05 Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components
F1376-92R05 Guide for Metallurgical Analysis for Gas Distribution System Components
F1388 Test Method for Generation Lifetime and Generation Velocity of Silicon Material by Capacitance-Time Measurements of Metal-Oxide-Silicon (MOS) Capacitors
F1389 Test Methods for Photoluminescence Analysis of Single Crystal Silicon for III-V Impurities
F1390 Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning
F1391 Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption
F1392 Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements With a Mercury Probe
F1393 Test Method for Determining Net Carrier Density in Silicon Wafers by Miller Feedback Profiler Measurements With a Mercury Probe
F1394-92R05 Test Method for Determination of Particle Contribution from Gas Distribution System Valves
F1396-93R05 Test Method for Determination of Oxygen Contribution by Gas Distribution System Components
F1397-93R05 Test Method for Determination of Moisture Contribution by Gas Distribution System Components
F1398-93R05 Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components
F1404-92R99 Test Method for Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique
F1438-93R05 Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components
F1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
F1466-99R05 Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications
F1467-99R05 Guide for Use of an X-Ray Tester (|mF10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
F1512-94R03 Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
F1513-99R03 Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
F1526 Test Method for Measuring Surface Metal Contamination on Silicon Wafers by Total Reflection X-Ray Fluorescence Spectroscopy
F1527 Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
F1528 Test Method for Measuring Boron Contamination in Heavily Doped -Type Silicon Substrates by Secondary Ion Mass Spectrometry
F1529 Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure
F1530 Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
F1535 Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
F1569 Guide for Generation of Consensus Reference Materials for Semiconductor Technology
F1570-01E01 Test Method for Determining the Tactile Ratio of a Membrane Switch
F1578-01 Practice for Contact Closure Cycling of a Membrane Switch
F1593-97R02 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer
F1594-95R03 Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications
F1595-00R05 Practice for Viewing Conditions for Visual Inspection of Membrane Switches
F1596-00R05 Practice for Exposure of Membrane Switches to Temperature and Relative Humidity
F1597-02 Test Method for Determining the Actuation Force and Contact Force of a Membrane Switch
F1598-95R02 Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)
F1617 Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry
F1618 Practice for Determination of Uniformity of Thin Films on Silicon Wafers
F1619 Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with -Polarized Radiation Incident at the Brewster Angle
F1620 Practice for Calibrating a Scanning Surface Inspection System Using Monodisperse Polystyrene Latex Spheres Deposited on Polished or Epitaxial Wafer Surfaces
F1621 Practice for Determining the Positional Accuracy Capabilities of a Scanning Surface Inspection System
F1630 Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities
F1661-96R02 Test Method for Determining the Contact Bounce Time of a Membrane Switch
F1662-04 Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch
F1663-95R02 Test Method for Determining the Capacitance of a Membrane Switch
F1680-02 Test Method for Determining Circuit Resistance of a Membrane Switch
F1681-96R02 Test Method for Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit
F1682-02 Test Method for Determining Travel of a Membrane Switch
F1683-05E01 Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component
F1684-99R05E01 Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications
F1689-05 Test Method for Determining the Insulation Resistance of a Membrane Switch
F1708 Practice for Evaluation of Granular Polysilicon by Melter-Zoner Spectroscopies
F1709-97R02 Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
F1710-97R02 Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
F1711-96R02 Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
F1723 Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy
F1724 Test Method for Measuring Surface Metal Contamination of Polycrystalline Silicon by Acid Extraction-Atomic Absorption Spectroscopy
F1725 Guide for Analysis of Crystallographic Perfection of Silicon Ingots
F1726 Guide for Analysis of Crystallographic Perfection of Silicon Wafers
F1727 Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
F1761-00R05 Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets
F1762-02 Practice for Exposing a Membrane Switch to Variation in Atmospheric Pressure
F1763 Test Methods for Measuring Contrast of a Linear Polarizer
F1771 Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique
F1809 Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
F1810 Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers
F1811 Practice for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data
F1812-02 Test Method for Determining the Effectiveness of Membrane Switch ESD Shielding
F1842-02 Test Method for Determining Ink or Coating Adhesion on Plastic Substrates for Membrane Switch Applications
F1843-97R02 Practice for Sample Preparation of Transparent Plastic Films for Specular Gloss Measurements, on Membrane Switch Overlays
F1844-97R02 Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
F1845-97R02 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer
F1892-04 Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
F1893-98R03 Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
F1894-98R03 Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness
F1895-98R04 Practice for Submersion of a Membrane Switch
F1896-98R04 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
F1982 Test Methods for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography
F1995-00R05 Test Method for Determining the Bond Strength of a Surface Mount Device (SMD) on a Membrane Switch by Applying Shear Force
F1996-01 Test Method for Silver Migration for Membrane Switch Circuitry
F1997-99R05 Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch
F2072-01 Practice for Hosedown of a Membrane Switch
F2073-01 Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch
F2074 Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
F2086-01 Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2
F2112-02 Terminology for Membrane Switches
F2113-01E01 Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
F2114-02 Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch
F2139 Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
F2166 Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers
F2187-02 Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
F2188-02 Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
F2357-04 Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool |P`RCA|P' Abrader
F2358-04 Guide for Measuring Characteristics of Sapphire Substrates
F2359-04 Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source
F2360-04 Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source
F2405-04 Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer